Features：

1.     Optimized design and advanced technology, excellent and precise manufacturing;

2.     Advanced technology application and creation to reassure the best machine performance;

3.     Adhering to the rigorous and pragmatic tradition of equipment manufacturing, the machine is durable with good reputation and low failure rate;

4.     The most efficient heating and conduction, allows ΔT control inside the chamber to be ±1℃

5. The exclusive patented flux collection system makes the chamber clean, reduce maintenance time and cost;

Intelligent nitrogen monitoring and control system and valve control, according to the oxygen content in the chamber, automatically adjust valve opening ratio (from 0---100%) to ensure the chamber stability, also to save the nitrogen consumption to maximum. Our nitrogen consumption is only 50% of other competitors, helping customers to control the production cost of nitrogen consumption;

6. High performance and durable seals are used, advanced design ensures good air tightness, the oven achieves a minimum of 20 PPM oxygen content, and keep the set values very well;

7.User-friendly operation interface, advanced touch screen technology; using USB to secure installation, software backup, easy to operate. Program backup, restore, data import& export, save all the time information of the software system to facilitate engineers to track and share any anomalies; there is an optional MES system for easy tracking the situation of the products in the oven (widely used in automotive and other important industry);

8. Automatic switch on/off function, convenient for operators to save time, especially for one-shift production (for example, setting the automatic startup at 7:00 a.m. on Monday morning and 6:00 p.m. automatic shutdown);

9.Wide range of applications for all SMT production soldering processes. Preheating zone can be set to a maximum of 300-350 ℃, vacuum zone can be set to a maximum of 300 ℃

10.Patented in-line vacuum system, can reduce void rate by 99%. The standard width of vacuum chamber is 510mm, length is 320mm-400mm, can be customized;

11. The cycle time is from 45 to 90s, vacuuming can be finished in around 30s;

12.Optimized design with single-step pumping or step-by-step pumping. It can be divided into 5 steps (e.g. from1000 mbar - 500 mbar -300 mbar - 100 mbar - 10 mbar - 1 mbar);

13.Minimum vacuum can reach 1 mbar, void rate is less than 1% of individual solder joints, less than 5% for the whole PCB. This is something that standard hot air reflow oven can never achieve. It is widely used in the soldering of semiconductor, bare chips in ceramics, copper PCB LED, BGA, and high-power components;