Semiconductor vacuum oven
This equipment is specialized for semiconductor power devices, IGBT and other high-power modules, products that require high-temperature soldering.

Address:Guang sheng rong Industrial park, No.94 ,Guangtian Road, Songgang Street, Bao’an District, Shenzhen China

 

Mobile:+86 15889432790

 

Semiconductor Vacuum Oven Specification:

Basic parameters

  Models

HTC-612D

HTC-613D

Dimension mm

L6300*D1450*H1560

L6300*D1450*H1560

  Weight

APPROX3000KG

APPROX3100KG

  Number   of heating zones

Top   6/ bottom 6

Top   6/ bottom 6

  Number   of cooling zones

Top   2/ bottom 2

Top   3/ bottom 3

  Cooling method

Forced ice cooling

Exhaust   requirements

10m3 /H*2

  Void rate

APPROX:1%-2%

Control system

  Power requirements

3P      380V 50/60Hz

3P 380V 50/60Hz

  Total power

60KW

64KW

      Segmented starting power

35KW

35KW

Power consumption

APPROX12KW-18KW

APPROX13KW-18KW

Hot air blower speed regulation

                                                                                     Inverter stepless speed regulation

   Heating time

APPROX30min

  Temperature control range

                                                                                     Room temperature ~ 400°C can be set

Production   recipes

                                                                        Multi-combination production recipes can be stored

Transportation

Number of lanes

Single lane

Rail   structure

                                                               3-segment combined structure

    Pallet dimension(mm)

L330*D250

L330*D330

    Conveyor height(mm)

900±20

     Mode   of conveying

                                                                       Isometric board-pushing

Vacuum system

    Minimum   vacuum pressure

0.1Kpa

Vacuum pump flow

APPROX:1000L/min

APPROX1000L/min

Pressure   relief time

≤10s

 Production   efficiency

≥40 s

Optional nitrogen system

Nitrogen   structure

                                                                                     Full/partial  nitrogen filling

   Nitrogen   system

Automatic

Nitrogen   consumption

APPROX300-500L/min


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