Vacuum Reflow Oven
Vacuum Reflow Oven is a very advanced oven, to avoid air bubbles from generating during the soldering process.

Address:Guang sheng rong Industrial park, No.94 ,Guangtian Road, Songgang Street, Bao’an District, Shenzhen China

 

Mobile:+86 15889432790

 

Specification

Model

KC-Z104

Weight

Apprx:2500KG

Dimension

6025×1350×1500mm

Heating zone qty.

Top10/ bottom 10

 

Cooling zone qty.

Top 4/ bottom 4

Cooling way

Forced water cooling

Rectifying plate structure

Carbon heating plate

Exhausting requirement

10/min×2

Control system

Power supply

3P 380V 50/60HZ

Total power

54KW

Startup power

38KW

Consumption power

12KW

Speed adjusting

3 sections with 3 inverters

Warm up time

Apprx.20minute

Temp. control range

Room temp.300℃ (adjustable)

Temp. control accuracy

±1℃

PCB temp. deviation

±1.5℃

Data store

Can store unlimited setting parameters

Abnormal alarm

High temp., low temp., conveying, vacuum pressure,   nitrogen, air volume, PCB entering abnormal

Conveying system

Rail structure

Separately controlled in 3 sections

PCB   max. width

400mm*350mm

Conveyor height

900±200MM

Conveying way

Chain

Vacuum system

Vacuum min. pressure

0 .1MP

Vacuum pump power

3KW rotary vane wet

Vacuum pressure relief time

10S

Vacuuming time

10-300S

Vacuum chamber open way

Electric

Vacuum chamber size

500*400*300mm

Production beat

20S

Nitrogen system (option)

Nitrogen period

The whole production time

Nitrogen concentration

500-1000PPM

Nitrogen consumption

15-30m³